康涅狄格州特伦布尔 - SMTA中国最近授予Artesyn嵌入式技术和EnthoneSMTA中国南部会议上的“技术最佳论文第二篇会议”。纸，“与有机金属一起生活^®PCB最终饰面 - PCB组装实现，”研究了如何确定一个新的有机金属工艺要优于评估的其他PCB饰面。

该论文详细介绍了Artesyn高级制造工程集团与ENTHONO OEM与全球开发与应用团队之间的为期两年的联合项目。该项目包括对当今市场上现有的PCB最终饰面进行比较的密集评估，以及新兴的饰面平台，包括Entek^®OM有机金属过程，由Artesyn选择进行最终验证测试。

Tory Chen, Artesyn’s Supervisor of Advanced Manufacturing Engineering - Embedded Computing & Power, CDE, and Sunny Mu, OEM Marketing Manager, Enthone Asia, presented the paper, which was also co-authored by WM Cheng, Senior Technical Manager, Advanced Manufacturing Engineering, of Artesyn and Ken Chow, OEM & Business Development Director, Enthone Asia. Chow said, “We are grateful to Artesyn for allowing us to closely collaborate with them. As witnessed by our joint project, selection of the right lead-free PCB final finish is critical to PCBA reliability.”

Entek OM是一种独特的新类PCB最终饰面，将有机焊料防腐剂的高可靠性和成本效益与金属饰面的所需属性结合在一起。具体而言，该过程提供了超过传统的有机焊料防腐剂的焊料能力，并且与金属饰面相媲美。Entek Om表现出低接触性，可大大减少组装时的错误故障。